And your deployment scenario (I think)Crosstalk and Noise
Because xCONNECT Links are a transition-based protocol rather than a level-based protocol, they are vulnerable to noise via crosstalk or EMI. Accordingly xCONNECT Links should be designed to minimize noise:
Do not route the signals closely in parallel for large distances. The traces need separating out to minimize cross-talk between the lines.
Do not route the signals close to noisy items on the PCB (such as switch-mode power supplies and clocks).
Try not to route the xCONNECT Link over splits in the ground plane, as the return ground currents can cause cross-talk.
If the traces are going over long distances, use low voltage differential signalling transceivers (LVDS) at each of the link to make the links immune to common-mode interference and improve the achievable symbol rate be utilized.
Pulldown Resistors
When xCONNECT Links are enabled, the wires should be logic low. Weak internal pull downs are active on the xCONNECT Link pins before they are enabled. These pull downs cannot be relied upon to pull down long traces with high capacitance. Circuit designers should apply external pull down resistors on such tracks.
But I'm probably preaching to the choir here.5w and 2w Link with up to 100mm of PCB Track
Link with 33R series terminating resistors close to the TX sides of each wire, using no driver chips.
regards
Al