Best way to solder L1 chip

Technical questions regarding the XTC tools and programming with XMOS.
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jagspaul
Experienced Member
Posts: 117
Joined: Tue Oct 18, 2011 3:28 pm

Best way to solder L1 chip

Post by jagspaul »

The centre ground pad for all XS1-L packages is the main device ground and must be
connected to circuit ground. Multiple vias should be used from the centre pad to the
circuit ground plane to minimise impedance and conduct heat away from the device.

Above information I have got from XS1-L Hardware Design Checklist

With drag soldering I can easily solder LQFP & TQFP package L1 chip. But I worried of proper soldering the center ground pad for all XS1-L packages.

Can anybody help me in this regards? If possible please give a youtube link.

Thanks
jags


bearcat
Respected Member
Posts: 283
Joined: Fri Mar 19, 2010 4:49 am

Post by bearcat »

jagspaul
Experienced Member
Posts: 117
Joined: Tue Oct 18, 2011 3:28 pm

Post by jagspaul »

Hi bearcat,

Thanks. It's quite cool.

jags
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