The centre ground pad for all XS1-L packages is the main device ground and must be
connected to circuit ground. Multiple vias should be used from the centre pad to the
circuit ground plane to minimise impedance and conduct heat away from the device.
Above information I have got from XS1-L Hardware Design Checklist
With drag soldering I can easily solder LQFP & TQFP package L1 chip. But I worried of proper soldering the center ground pad for all XS1-L packages.
Can anybody help me in this regards? If possible please give a youtube link.
Thanks
jags
Best way to solder L1 chip
There a few threads on the topic. You can use search.
http://www.xcore.com/forum/viewtopic.php?f=7&t=608
http://www.xcore.com/forum/viewtopic.php?f=7&t=919
http://www.xcore.com/forum/viewtopic.php?f=7&t=1703
http://www.xcore.com/forum/viewtopic.php?f=7&t=608
http://www.xcore.com/forum/viewtopic.php?f=7&t=919
http://www.xcore.com/forum/viewtopic.php?f=7&t=1703
Hi bearcat,
Thanks. It's quite cool.
jags
Thanks. It's quite cool.
jags