xn file for 3 L1's and SDK 12.2.2

[lilltroll]

So I have a custom board with 3 L1's mounted at the moment

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Available XMOS Devices
----------------------

  ID    Name                    Adapter ID      Devices
  --    ----                    ----------      -------
  0     XMOS XTAG-2             lSJR3akh        L1[0..2]

Can anyone give me a hint how to write the xn file under 12.2.2 where tiles and stuff exists.

The topology looks like this:

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L1 {B} ---  {B} L1 {C} ----- {A} L1
           flash   {D} ----- {B}

[lilltroll]

Trial and horror

Is there some HOWTO documents for this somewhere??

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<?xml version="1.0" encoding="UTF-8"?>
<Network xmlns="http://www.xmos.com"
xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"
xsi:schemaLocation="http://www.xmos.com http://www.xmos.com">
  <Type>Custom Board</Type>
  <Name>QUAD C5 devices</Name>

  <Declarations>
    <Declaration>tileref tile[3]</Declaration>
  </Declarations>

  <Packages>
    <Package id="0" Type="XS1-LnA-64-LQ64">
      <Nodes>
        <Node Id="0" InPackageId="0" Type="XS1-L8A-64" SystemFrequency="500MHz">
          <Tile Number="0" Reference="tile[0]"/>
        </Node>
      </Nodes>
    </Package>
     <Package id="1" Type="XS1-LnA-64-TQ128">
      <Nodes>
        <Node Id="1" InPackageId="1" Type="XS1-L8A-64" SystemFrequency="500MHz">
          <Tile Number="1" Reference="tile[1]"/>
        </Node>
      </Nodes>
    </Package>
   <Package id="2" Type="XS1-LnA-64-LQ64">
      <Nodes>
        <Node Id="2" InPackageId="2" Type="XS1-L8A-64" SystemFrequency="500MHz">
          <Tile Number="2" Reference="tile[2]"/>
        </Node>
      </Nodes>
    </Package>
    </Packages>

    <Links>
        <Link Encoding="2wire" Delays="0,1">
            <LinkEndpoint NodeId="0" Link="XLB"/>
            <LinkEndpoint NodeId="1" Link="XLB"/>
        </Link>
        <Link Encoding="2wire" Delays="0,1">
            <LinkEndpoint NodeId="1" Link="XLC"/>
            <LinkEndpoint NodeId="2" Link="XLA"/>
        </Link>
        <Link Encoding="2wire" Delays="0,1">
            <LinkEndpoint NodeId="1" Link="XLD"/>
            <LinkEndpoint NodeId="2" Link="XLB"/>
        </Link>
    </Links>
  
    <ExternalDevices>
        <Device NodeId="1" Tile="1" Name="bootFlash" Class="SPIFlash" Type="M25P16">
            <Attribute Name="PORT_SPI_MISO" Value="PORT_SPI_MISO" />
            <Attribute Name="PORT_SPI_SS" Value="PORT_SPI_SS" />
            <Attribute Name="PORT_SPI_CLK" Value="PORT_SPI_CLK" />
            <Attribute Name="PORT_SPI_MOSI" Value="PORT_SPI_MOSI" />
        </Device>
    </ExternalDevices>


  <JTAGChain>
     <JTAGDevice NodeId="0"/>
     <JTAGDevice NodeId="1"/>
     <JTAGDevice NodeId="2"/>
  </JTAGChain>

</Network>

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C:\XMOS\xTIMEcomposer\12.2.0\configs\XS1-LnA-64-TQ128.pkg:4: Error: L00169 Package file includes unmapped node id "0".

[lilltroll]

This one compiles at least

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<?xml version="1.0" encoding="UTF-8"?>
<Network xmlns="http://www.xmos.com"
xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"
xsi:schemaLocation="http://www.xmos.com http://www.xmos.com">
  <Type>Custom Board</Type>
  <Name>QUAD C5 devices</Name>

  <Declarations>
    <Declaration>tileref tile[3]</Declaration>
  </Declarations>

  <Packages>
    <Package id="Package B" Type="XS1-LnA-64-LQ64">
      <Nodes>
        <Node Id="Core B" InPackageId="0" Type="XS1-L8A-64" Oscillator="25MHz" SystemFrequency="500MHz">
        <Boot>
          <Source Location="LINK"/>
        </Boot>
          <Tile Number="0" Reference="tile[0]"/>
        </Node>
      </Nodes>
    </Package>
     <Package id="Package C" Type="XS1-LnA-64-TQ128">
      <Nodes>
        <Node Id="Core C" InPackageId="0" Type="XS1-L8A-64" Oscillator="25MHz" SystemFrequency="500MHz">
          <Boot>
           <Source Location="SPI:bootFlash"/>
           <Bootee NodeId="Core B" Tile="0"/>
           <Bootee NodeId="Core D" Tile="2"/>
      </Boot>
          <Tile Number="0" Reference="tile[1]"/>
        </Node>
      </Nodes>
    </Package>
   <Package id="Package_D" Type="XS1-LnA-64-LQ64">
      <Nodes>
        <Node Id="Core D" InPackageId="0" Type="XS1-L8A-64" Oscillator="25MHz" SystemFrequency="500MHz">
        <Boot>
          <Source Location="LINK"/>
        </Boot>
          <Tile Number="0" Reference="tile[2]"/>
        </Node>
      </Nodes>
    </Package>
    </Packages>

    <Links>
        <Link Encoding="2wire" Delays="0,1">
            <LinkEndpoint NodeId="Core B" Link="XLB"/>
            <LinkEndpoint NodeId="Core C" Link="XLB"/>
        </Link>
        <Link Encoding="2wire" Delays="0,1">
            <LinkEndpoint NodeId="Core C" Link="XLC"/>
            <LinkEndpoint NodeId="Core D" Link="XLA"/>
        </Link>
        <Link Encoding="2wire" Delays="0,1">
            <LinkEndpoint NodeId="Core C" Link="XLD"/>
            <LinkEndpoint NodeId="Core D" Link="XLB"/>
        </Link>
    </Links>
  
    <ExternalDevices>
        <Device NodeId="Core C" Tile="1" Name="bootFlash" Class="SPIFlash" Type="M25P16">
            <Attribute Name="PORT_SPI_MISO" Value="PORT_SPI_MISO" />
            <Attribute Name="PORT_SPI_SS" Value="PORT_SPI_SS" />
            <Attribute Name="PORT_SPI_CLK" Value="PORT_SPI_CLK" />
            <Attribute Name="PORT_SPI_MOSI" Value="PORT_SPI_MOSI" />
        </Device>
    </ExternalDevices>


  <JTAGChain>
     <JTAGDevice NodeId="Core B"/>
     <JTAGDevice NodeId="Core C"/>
     <JTAGDevice NodeId="Core D"></JTAGDevice>
  </JTAGChain>

</Network>

[lilltroll]

I bypassed TDI and TDO to each chip and found out that 2 of them couldn't start due to a poor ground connection on the center pad* (I have a very large and thick ground-plane that eats heat) ; but attacking with the hot air + flux + a soldertip on the same time from behind made the solder to flow down the vias and connect to the center pad on the L1-64. I can now run hello world on each tile by it self.

*Something like "core is not enable" erro- message.

I'm soon ready to try and connect the 3 tiles again.

[Bianco]

I prefer the big hole method for home assembled boards

[lilltroll]

I prefer the big hole method for home assembled boards

Same here, I'm used to do a larger center hole, but I'm new to Altium Designer which I used for this board. I used the integrated tool in Altium to create the footprints, but I will change the center hole size to the next revision.

[Bianco]

It's very easy to modify a footprint in Altium to get a hole.
Actually my library footprints don't have a hole.
When deployed on a PCB project you can right click the center pad and modify the settings.
Make it multilayer instead of top layer and set the hole size accordingly.
If you compare your footprints with the library it will note that it is different though.