Connecting ground pad on 64LQFP XS1-L1

[rp181]

I don't have access to a reflow oven, so I was wondering how to best connect the center ground pad. I am currently trying conductive silver epoxy, but I am unsure if it will work as it may present a couple of ohms of resistance.

I also a product called kopr-shield, a copper suspension in a petroleum based product. It worked well without vaporizing on my railgun, so I assume the resistance is quite low.

Suggestions?

[bearcat]

Solder from the back side is quite easy if you can get a hole in your PCB. The example PCB shown in the post below is for the L1-64. I might think drilling a hole in a finished PCB would be an option.

See the following post:
https://www.xcore.com/forum/viewtopic.php?f=7&t=608

[leon_heller]

That's how I do it on prototypes using QFN chips - I put a large via in the centre. I heat it with the soldering iron tip and feed solder into the hole.

[rp181]

That was my thought too, but I made the via too small :)

[leon_heller]

Drilling it larger should work, if you haven't soldered the chip.