Yes, and a radiator might just finish the chip off... ;-)Folknology wrote:No need of heatsink nassim
Technical discussions related to any XMOS development kit or reference design. Eg XK-1A, sliceKIT, etc.
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I used alluminium foil and a regular egg (just a bit of it), but the heat transfer from the chip to the foil is not that great and the foil acts as a heatsink to the air also. Then i spilled egg on my XC-1 and washed it with water. I was too impatient to wait for it to be dried completely and after i powered it up it made some weird pop sounds. After some longer drying it worked fully again :pFolknology wrote:Hey Bianco you have to crack them open first, it gets messy ;-)
No need of heatsink nassim
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Both my XC-1A, and XC-2, as well as all L devices I have barely get warm when not doingFolknology wrote:Interestingly Segher claimed with his tools and only 1 core active on the XC1A it ran cooler, but can't vouch for that..
much on them.
The XC-2 gets pretty hot when running the standard firmware on it (not even connected
My tools have nothing to do with it for what it's worth; those are just JTAG things, for uploading
code and (low-level) debug/introspection. And I do set the PLLs to 400MHz/100MHz
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