I'm all for KISS and low cost in the 40 pin DIP Module so external JTAG.
regards
Al
40pin DIP Module Using XS1-L1-48
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This raised to the power this.Omer wrote:A larger (yet still compact) module with an L2 (or even a G4!), some SRAM, Ethernet and/or USB connectivity would be awesome (something along the lines of this module, preferably with a sensible I/O connector). IMO it doesn't make much sense to have an L1 on a bigger DIP module.Corin wrote:Hence, would anybody be interested in bigger DIP type modules (e.g. 64-pin with more I/O)?
A module like this would simplify the design process for utilising multi-core XMOS devices in custom designs quite significantly.
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For L2/G4 using a dimm module rather than DIP prob makes sense
regards
Al
regards
Al
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For "larger" chips I would vote for a connectivity that can be used in small series like the one below, where the opposite connectivity can be placed by a production robot.
http://www.logicpd.com/products/system- ... orpedo-som
DIP is nice for bredboards.
http://www.logicpd.com/products/system- ... orpedo-som
DIP is nice for bredboards.
Probably not the most confused programmer anymore on the XCORE forum.
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Folknology wrote:For L2/G4 using a dimm module rather than DIP prob makes sense

Ditto! :)
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I wonder if at this point we've reaching an overlap with the slices?Omer wrote:Folknology wrote:For L2/G4 using a dimm module rather than DIP prob makes sense
Ditto! :)
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DIMM has at least 2 advantages.
You only need plating on the DIMM boards.
It is possible to solder the DIMM socket only by hand with an iron to a 2 layer board.
You only need plating on the DIMM boards.
It is possible to solder the DIMM socket only by hand with an iron to a 2 layer board.
Probably not the most confused programmer anymore on the XCORE forum.
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One could also design boards to house more than a single L2/G4 Dimm for more advanced requirements which is another advantage, its also very compact.
regards
Al
regards
Al
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Yes, DIM sounds great for more output pins. Still want a super easy 40 pin DIP ;)
And yes I als think it has relevance for the slice kit too (will the slice kit use DIM too? is the LC2 Dim variant just the heart of the slice kit and the slice kit jsut a breakout backplane?).
And yes I als think it has relevance for the slice kit too (will the slice kit use DIM too? is the LC2 Dim variant just the heart of the slice kit and the slice kit jsut a breakout backplane?).
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The advantage of an L2/G4 dimm is it deals with a lot of the hard stuff like tricky package placement, the PITA stuff like multiple supply and monitoring plus boot flash. It offers full I/O for your specific application = maximum flexibility
It is also more cost effective for Xmos as the dimm has no separate connectors just gold fingers and can be built fully in a volume pick and place, thus making it lower cost for everyone.
Xmos should offer both 40P L1 DIP and L2 /G4 Dimms IMHO
regards
Al
It is also more cost effective for Xmos as the dimm has no separate connectors just gold fingers and can be built fully in a volume pick and place, thus making it lower cost for everyone.
Xmos should offer both 40P L1 DIP and L2 /G4 Dimms IMHO
regards
Al