Hello,
1- I just wanted to know what kind of commercial products have you produced or are you working on as a commercial product using XMOS chips?
2- What are you using XMOS chips for? are you using XMOS chips as main processors or as peripheral (controller) co-processor?
What are you doing with XMOS chips ?
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I'm using three L1's for an amplify/filter/adc/compressor board that sends 4 channels of accelerometer data at up to 100kHz to a BigData (Cassandra/Hadoop) farm on the network.
This is the layout I'm sending to the fab. Click it to see more detail. .
TCP/IP interface is handled by a PIC32 that hangs on the left connector. I hope to have that pulled into an XMOS core in a future revision. This is a 6 layer board, with a 128TQFP and a 64TQFP on the front, and one 128TQFP on the back. The XLB XLD connectors at the bottom allow strapping two or more boards together using 5w links, so that I can have n*4 channels onto a single ethernet connection.
The processor on the right drives the analog section, the one on the top/back handles buffering in the 32MB of SDRAM (that's the rectangular device on the back), and the one on front/left handles communication between boards. There is a smattering of additional I/O brought to the other connectors, and a couple of sets of LEDs for diagnostics and visualizing buffer state. The LEDs are driven from 3v3 and selected by driving the pins low. They are are also brought to connectors, so they can be optionally be used as pulled-up inputs.
UPDATE For anyone who is interested in my layout, I may move to diamond formation on the devices for a future iteration. (Rotating all XMOS devices by 45deg.) I'm interested to know if anyone has experience with 45deg placement in design/manufacturing.
This is the layout I'm sending to the fab. Click it to see more detail. .
TCP/IP interface is handled by a PIC32 that hangs on the left connector. I hope to have that pulled into an XMOS core in a future revision. This is a 6 layer board, with a 128TQFP and a 64TQFP on the front, and one 128TQFP on the back. The XLB XLD connectors at the bottom allow strapping two or more boards together using 5w links, so that I can have n*4 channels onto a single ethernet connection.
The processor on the right drives the analog section, the one on the top/back handles buffering in the 32MB of SDRAM (that's the rectangular device on the back), and the one on front/left handles communication between boards. There is a smattering of additional I/O brought to the other connectors, and a couple of sets of LEDs for diagnostics and visualizing buffer state. The LEDs are driven from 3v3 and selected by driving the pins low. They are are also brought to connectors, so they can be optionally be used as pulled-up inputs.
UPDATE For anyone who is interested in my layout, I may move to diamond formation on the devices for a future iteration. (Rotating all XMOS devices by 45deg.) I'm interested to know if anyone has experience with 45deg placement in design/manufacturing.
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@russf
impressive looking board :)
What chip are you using for your analog inputs?
impressive looking board :)
What chip are you using for your analog inputs?
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Thanks Tony,
A lot of work in there....
Analog chain is: MCP6S93, MAX296, MCP3301
I was fairly careful with the layout of the analog parts, and I have ground planes and ground fills as appropriate.
We'll see how good a job I did, in a few weeks.
If you have any comments, let me know ;)
--r
A lot of work in there....
Analog chain is: MCP6S93, MAX296, MCP3301
I was fairly careful with the layout of the analog parts, and I have ground planes and ground fills as appropriate.
We'll see how good a job I did, in a few weeks.
If you have any comments, let me know ;)
--r
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Hi Octal,
we are currently integrating a XS1-L2 into our main product (the KissBox). You can see a picture of the development unit in my profile (and I can send you a picture of the PCB being routed if you want)
Product should be ready before July if planning is followed
I am also working on a remote audio processor, also based on a XS1-L2, but the main processor is an Analog Devices DSP.
Benoît
we are currently integrating a XS1-L2 into our main product (the KissBox). You can see a picture of the development unit in my profile (and I can send you a picture of the PCB being routed if you want)
Product should be ready before July if planning is followed
I am also working on a remote audio processor, also based on a XS1-L2, but the main processor is an Analog Devices DSP.
Benoît
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Hey Benoit we all love to see project pics/design, please put them up
I presume its a 4 layer board your working on?
regards
Al
I presume its a 4 layer board your working on?
regards
Al