I don't have access to a reflow oven, so I was wondering how to best connect the center ground pad. I am currently trying conductive silver epoxy, but I am unsure if it will work as it may present a couple of ohms of resistance.
I also a product called kopr-shield, a copper suspension in a petroleum based product. It worked well without vaporizing on my railgun, so I assume the resistance is quite low.
Suggestions?
Connecting ground pad on 64LQFP XS1-L1
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Solder from the back side is quite easy if you can get a hole in your PCB. The example PCB shown in the post below is for the L1-64. I might think drilling a hole in a finished PCB would be an option.
See the following post:
https://www.xcore.com/forum/viewtopic.php?f=7&t=608
See the following post:
https://www.xcore.com/forum/viewtopic.php?f=7&t=608
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That's how I do it on prototypes using QFN chips - I put a large via in the centre. I heat it with the soldering iron tip and feed solder into the hole.
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That was my thought too, but I made the via too small :)
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Drilling it larger should work, if you haven't soldered the chip.